Aluminum fin copper base aluminum base can be.
Bonded fin heat sink.
The material for bonding process can be not only aluminum but also copper.
Bonded fin heat sinks overcome some of the limitations of extruded aluminum heat sinks by allowing much taller fin heights and denser fin spacing.
Aluminum copper stainless steel inconel aluminum copper stainless steel inconel general design guidelines.
Fin thickness typically ranges from 010.
Bonded fin heat sinks.
Fin thickness typically ranges from 010 to 080 other thicknesses as needed brazed.
High fin density extrusion.
Higher aspect ratio and high fin density of fins increase cooling surface area so the heat sink with high performance.
Lower thermal resistance for the high power device heat dissipation.
High fin density extrusion.
It cna be used for various applications such as dc dc brick or an electric welder.
Bonded fin heat sinks aluminum copper or mixed metal bonded fin assemblies copper base and aluminum fin 44 1 or greater fin ratios fins fabricated from sheet metal or extrusion increased surface area lower thermal resistance up to 21 in.
Bonded fin heat sink they are made by individual fin and be bonded to a base.
Sns cooling technology offers bonded fin products with ratios as high as 40 1.
533 4mm width bases used for high power forced convection.
Reduces heat sink and overall system volume.
Bonded brazed fin heat sink product details.
Bonded fin heat sink.
They also make it possible to use other metals such as copper which have greater thermal conductivity but are not as readily extruded as aluminum.
Increases the cooling surface area by 2 to 3 times higher aspect ratio of fins dissipates more heat than conventional heat sinks with same footprint.
Bonded fin heat sinkfeatures as the following.
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